More than Moore via 2.5D IC integration technology - Automotive electronic control unit (ECU) for ADAS application based on a Chiplet approach

Name: More than Moore via 2.5D IC integration technology - Automotive electronic control unit (ECU) for ADAS application based on a Chiplet approach
Start: 2022-10-12T16:00:00+02:00
End: 2022-10-12T17:00:00+02:00

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Date & Time

from	12-10-202216:00
until	12-10-202217:00
duration	1 hour

Location

city	Dresden, Deutschland

Contact

name	Mr. Marie NoackFraunhofer EAS
email	Marie.Noack@eas.iis.fraunhofer.de

Based on the state of the art of integration technologies, our webinar shows possible integration approaches for chiplet based multi die systems to build future ECU architecture e.g. for ADAS application. Furthermore, we discuss current and future chip to chip standards and their advantages and disadvantages for automotive applications.